Ufs Bga: 254 Datasheet
The UFS BGA 254 is a high-performance Multi-Chip Package (MCP) standard that combines Universal Flash Storage (UFS) and LPDDR RAM into a single 254-ball grid array. This configuration is widely used in mid-to-high-end smartphones to save motherboard space while delivering high-speed data transfer through serial interfaces. Core Technical Specifications Package Type: BGA 254 (254-ball Ball Grid Array). Dimensions: Typically with a height ranging from to . Interface Protocols: UFS 3.1: Features speeds up to read and write. UFS 4.0: Features speeds up to read and write. Voltage Requirements: Standard supplies include VCC ( ) for NAND and VCCQ ( or ) for the controller/PHY. Operating Temperature: Generally rated from to for consumer mobile use, with automotive variants reaching . Functional Layout and Pinout UFS Memory Device Data Sheet Revision 1.10 (Dec., 2017)
Specifications
- Package Dimensions: Specific dimensions can vary, but typically, BGA packages are small, e.g., around 6.5mm x 8mm or similar, depending on the exact specification.
- Number of Balls: 254
- Ball Pitch: Usually 0.4mm or 0.5mm, which allows for high-density mounting.
Standard UFS BGA 254 chips (typically UFS 2.x, 3.x, or 4.x) follow common electrical and physical characteristics as outlined in industry standards like JEDEC. : UFS 2.1 / 3.1 / 4.0 (Backwards compatible). Voltage Rails : Core voltage (typically 2.7V – 3.6V). : I/O voltage (typically 1.14V – 1.26V). : Auxiliary interface voltage (typically 1.70V – 1.95V). Performance : Read speeds up to and write speeds up to depending on the controller and programmer used. Physical Layout : 254-ball grid, often in an 11.5mm x 13.0mm form factor. Amazon.com 2. Pinout Configuration (Critical Pins) Ufs Bga 254 Datasheet
The UFS BGA 254 datasheet is an essential document for designers, engineers, and manufacturers working with UFS devices. It provides critical information about the package's performance, electrical characteristics, and mechanical properties, which are necessary for: The UFS BGA 254 is a high-performance Multi-Chip
Hardware Compatibility: Tools like the Z3X Easy-Jtag Plus or the ICFriend 4-in-1 Socket are required. Form Factor Standard UFS BGA 254 chips (typically UFS 2
Electrical Characteristics: Operating voltage ranges, power consumption in sleep vs. active modes, and signal integrity requirements.
